集成電力電子模塊（IPEM）綜述

摘要：用非標(biāo)準(zhǔn)件制造電力電子產(chǎn)品，導(dǎo)致生產(chǎn)勞動(dòng)強(qiáng)度大、成本高、可靠性差等問(wèn)題。為了解決這些問(wèn)題，并進(jìn)一步顯著改善電力電子系統(tǒng)的性能，有必要應(yīng)用“集成電力電子模塊”（IPEM）技術(shù)，開發(fā)一種電力電子系統(tǒng)集成方法。要實(shí)現(xiàn)電力電子系統(tǒng)的高度集成，需要更好的封裝技術(shù)，以提高其功率密度、改善性能和散熱條件。此外，也需要將“分析和設(shè)計(jì)”軟件集成，使集成技術(shù)有突破性的發(fā)展，并且使材料的物理性質(zhì)得以充分利用。 敘詞：集成電力電子模塊 系統(tǒng)集成 電力電子集成塊 封裝技術(shù) Abstract：In order to provide future significant improvements in performances of power electronic systems to overcome problems of using non-standard parts in manufacturing proccess,resulting in labor intensive production,increased cost,and poor reliability,it is essential to develop an integrated power electronic system approach in the form of IPEMs.Moving to a highly integrated system requires better packaging techniques to increase power density,improve performance and thermal management.Moreover,integrated analysis and design tools are necessary to develop breakthrough integration techniques that fully exploit the physical properties of available materials. Keyword：integrated power electronics module(IPEM) system integration power electronics building block(PEBB) packaging techniques